Programmable comprehensive calibration of all subsystems from Precise parameters profiles tailored to suit specific process Real time graphics display (GUI), process data acquisition, display, Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Branson/IPC 2000, Branson/IPC 3000, Branson/IPC 4000, Barrel Asher, Barrel Etch, Barrel Etcher Low cost production-proven plasma Asher / Descumįront and backside isotropic photoresist removal. Pressure Control Throttle Valve for better process repeatability. New controller with PC with Advanced AW Softwareġ3.56 MHz RF Generator. Many wafer sizes capability without hardware change.Ĭan handle different thickness wafer with different carriers. Samples, 6” square, and up to 8” round wafers capable. TC Option can be used with an N2 Plasma to heat the wafers up toĮnd-of-Process (EOP) Option automatically stops the Process afterĪll wafers are fully stripped regardless of wafer quantity or Production-proven plasma Stripper/Asher/Descum technology. Manufacturer’s concerns for Uptime, Reliability, Production-Proven technology. Plasma photoresist removal system for high-volume wafer fabrication. The AW-B3000 batch/barrel photoresist asher is a manual load tool designed as a flexible 13.56 MHz RF Barrel Plasma Asher Plasma Descum AW-B3000
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